Introduction

This equipment belongs to one of the small-format precision laser cutting machine models, mainly used in the fourth stage of IC chip manufacturing process - assembly and packaging (narrow sense of packaging, non-packaging engineering) on the first stage of the process

After this cutting process, the Wafer with certain circuit characteristics is divided into particles with certain size requirements, which are then screened by different electrical standards. Qualified products are delivered to the end customer after packaging (die) and testing process. According to different uses, it becomes a "CPU" for different industry applications (that is, a small rectangular block with different pins and pins).

The device is through a specific laser beam that can have a certain reaction with the material (mainly manifested as absorption effect) through the light guide shaping system of the external optical path, radiate to the wafer under the guidance of the visual mark point, and with the motion mechanism with a certain precision to form a cutting track, to complete the segmentation of small pieces of grain

This page only introduces the simple cutting (square or round small grain forming parts) process of chips less than 6 inches (standard thickness 625±25mmm)

Technical parameters

Picture for reference